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Solventless lamination is a method that uses solvent-free adhesive to combine two or more substrates together. The solventless laminating machine provides the high-precise coating with a weight-detecting system and the machine is the best combination of coating and laminating position, driven coating system and automatic unwind & rewind for high efficiency, consistent tension & minimum waste during roll changes.
The solventless lamination machine is used for all kinds of flexible laminating bags with two-layer, three-layer, four-layer. The solvent-free laminator is suitable for light packaging, including OPP / CPP, PET / PE, PA / PE, OPP / VMCPP. It has covered the whole field of the flexible packaging industry.
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The carbide dies have several tens of times longer service life than steel molds. The carbide mold has high hardness, high strength, corrosion resistance, high-temperature resistance, and small expansion coefficient, generally composed with tungsten cobalt.
Grades and production technology
The grades mainly include YG3, YG6, YG6X.YG8.YG15, YG20, YG20C, YG25 and HU20, Hu222, HWN1, etc.

Tungsten carbide dies to adopt native carbide material with special low-pressure sintering processes. The toughness will be better than routine production and the service life will increase by 3-5 times.

Classification
The carbide mold can be divided into three categories according to the applications.

1. Tungsten brushed mold, which is the most used carbide mold. The main grades include YG8, YG6, YG3, followed by YG15, YG6X, YG3X, a new grade YL used for high-speed brushes.

2. Cold rolling die & shaped mold, the main grades include YC20C, YG20, YG15, CT35, YJT30 and MO15.

3. Nonmagnetic alloy molds for magnetic materials production, such as YSN series including 20, 25, 30, 35, 40 and steel knot-free magnetic die tags TMF.