MediaTek launched the Dimensity 1000 chipset only a few days ago. Meanwhile, the company apparently already has plans for a new product.

After the launch of the Dimensity 1000 chipset, three of MediaTek’s top Executives granted an interview to media outfits including IT Home, a Chinese tech website. These Executives include Li Yanji, Deputy General Manager of MediaTek Wireless Communication Division; Li Junnan, Technical Planning Director of MediaTek Wireless Communication Division; and Nian Yucun, Product Marketing Department Manager of MediaTek Wireless Communication Division.

According to IT Home’s report, MediaTek answered questions about the plans of MediaTek to take on Qualcomm’s upcoming Snapdragon 875 chipset. Li Yanji responded that MediaTek would have products coming out at the appropriate time and that the company would not be absent from the flagship front.

Yanji also answered a question about the impact of Qualcomm’s latest move to cut prices for its mid-range 5G chipsets for mobile phones. According to him, market and price competition will always exist. He said that MediaTek would respond by launching 5G chips that have better performance and power consumption than the competitors.

It is worthy of note that MediaTek has not really been at the forefront of flagship chips in a long while. The Taiwanese company just came back to the scene with the latest Dimensity series. On paper, this series has proven to be a powerful series. Of course, the Helio G series is quite impressive in the mid-range 5G series too.

It is now left to be seen if MediaTek will indeed successfully take on Qualcomm in the flagship segment.

Randerl:
That news is of no use to Transsion Holdings and users of her products.